Work with customers to develop & optimize advanced packaging processes for semiconductor manufacturing; Serve as lead tech interface for customers, help develop & optimize packaging recipes; Review applicants & create requests for tooling; Troubleshoot & repair semiconductor packaging equipment; Train engineers to use equipment; Perform PM on machines; Communicate & align with customer; Escalate issues to team & work with them for resolutions; Prepare summary reports & customer presentations.
Requires experience with: working on & troubleshooting highly advanced machinery including oscilloscopes & semiconductor assembly machines like die bonder, pick & place, flip-chip, Thermo-Compression bonding equipment; working with vision inspection & mechatronic systems, including high resolution camera, high accuracy & high-speed machines; semiconductor manufacturing processes & equipment for advanced packaging; customer support & management; Data Analysis, including working knowledge of Matlab or Python; MS Office suite, especially Excel & PowerPoint.
Requires: Bachelor's degree or foreign equivalent in Mechanical Engineering, Electrical Engineering or related field, & 3 years experience as Engineer working with semiconductor packaging or related occupation.
Itinerant Employment - may be required to work at various unanticipated locations in U.S. Domestic travel & occasional international travel required, up to 20% of time.
Send C.V. to [email protected]
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